High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.
4. Flexible substrate processing ■No.4-1: Example of blind hole processing for single-sided flexible substrates with diameters from φ20um to φ50um ■No.4-2: Example of blind hole processing for double-sided flexible substrates with diameters from φ25um to φ100um
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.