We will consider services based on your concerns! We will diagnose thermal issues in the early stages of product development.
Our "Thermal Issue Simplified Diagnosis Service" diagnoses thermal issues in the early stages of product development. We predict product temperatures from the conceptual stage and report on the presence of thermal issues along with one-point advice. We provide feedback on the validity of product size and heat dissipation strategies (such as the necessity of fans) in the early design phase. Additionally, we also offer a "Design Value Calculation Service." 【Features】 ■ Response within 3 days ■ Predict product temperatures from the conceptual stage ■ Report on the presence of thermal issues and provide one-point advice ■ Feedback on the validity of product size and heat dissipation strategies in the early design phase ■ Avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Items to be prepared by the customer】 ■ Product size ■ Presence of ventilation ■ Product power consumption ■ Heating component information ( datasheet, power consumption) *For more details, please refer to the PDF materials or feel free to contact us.
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Applications/Examples of results
【Usage Examples】 ■ Warpage verification of BGA packages ■ Drop impact resistance verification ■ Durability verification of metal springs ■ Durability verification of resin hooks *For more details, please refer to the PDF document or feel free to contact us.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
