Void processing for power module metal substrate reflow is possible!
The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.
Inquire About This Product
basic information
【Specifications (Excerpt)】 ■Temperature adjustment range: Hot plate max. 390℃, upper far-infrared heater max. 400℃ ■Temperature distribution on the substrate surface: ±3℃ ■Number of zones: 1 zone inside the furnace, 1 zone for external cooling ■Hot plate size: L=400×W400mm (heating) ■Flow direction: Left → Right *For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or contact us.
catalog（1）
Download All Catalogs
Company information
Our company continues to develop with the reliable technological capabilities we have cultivated so far, and we are a group of experts in "monozukuri" (manufacturing) that flexibly responds to changes in industry and society. We have established a comprehensive production management system that covers everything from design, can manufacturing, processing, assembly, testing, inspection, installation, to maintenance. The products that utilize the technology we have developed so far are widely supported by our customers.