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  6. Observation of diffusion layers in semiconductors using FIB-SEM.

Observation of diffusion layers in semiconductors using FIB-SEM.

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last updated:Jun 26, 2025

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Shorter delivery time than his method! Both shape observation using FIB-SEM and diffusion layer observation can be performed!

We are conducting "Observation of the diffusion layer of semiconductors using FIB-SEM." By creating cross-sections using the FIB method and observing them with SEM, we visualized the diffusion layer of semiconductors and evaluated their shapes. In a case where the difference in built-in potential was visualized using the Inlens detector of the SEM, a difference in the energy of secondary electrons generated in the N-type and P-type regions occurred due to the built-in potential. This difference in trajectories is detected by the SEM detector. 【Features】 - Both shape observation and diffusion layer observation can be performed using FIB-SEM. - Shorter delivery times compared to other methods. - Concentrations can be detected up to 10E16. - While the PN interface can be visualized, the concentration differences of N+/N- and P+/P- cannot be detected. *For more details, please refer to the PDF document or feel free to contact us.

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Observation of diffusion layers in semiconductors using FIB-SEM.

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  • Related Link - https://www.ites.co.jp/analyze/index.html
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Total support service for cross-section grinding, processing, observation, and analysis.

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Observation of diffusion layers in semiconductors using FIB-SEM.

Observation of diffusion layers in semiconductors using FIB-SEM.

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Total solution service for power devices

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Power device failure location / Slice & View three-dimensional reconstruction

Power device failure location / Slice & View three-dimensional reconstruction

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Power device failure location / Slice & View three-dimensional reconstruction

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I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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