Real-time measurement of the shrinkage rate and shrinkage stress of UV-curable and thermosetting resins. It measures the volume change from before curing to after curing.
The "CUSTRON" resin curing shrinkage stress measurement device continuously measures the curing shrinkage rate and shrinkage stress associated with the curing of UV-curable resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, and more. It allows for the flexible combination and setting of thermal profiles, such as heating, cooling, and UV irradiation, through programming. It reproduces the shrinkage rates and shrinkage stresses that products experience under various thermal conditions during the manufacturing process or when subjected to different environments over time. 【We have received positive feedback from customers like these】 ● It is groundbreaking because there has been no method for continuous measurement of resin shrinkage rates until now (currently, shrinkage rates are confirmed by measuring the shrinkage of the resin after curing). ● I was looking for a device that could perform continuous measurements, and I finally found it. ● It is helpful that I can use it on a spot basis without having to purchase the device. ● There is a sense of security because on-site measurements can also be conducted. ● It is more cost-effective than requesting analysis from other centers. 【Are you facing any of these issues?】 ● I want to smoothly verify the optimal curing conditions when using resin. ● Relying solely on destructive testing for verification is time-consuming and costly, leading to poor productivity.
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basic information
【Continuous Measurement of the Entire Process Before, During, and After Reaction】 Continuous measurement of curing shrinkage rate and shrinkage stress associated with the curing of UV-curable resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, etc. 【Heat Cycle Measurement】 The thermal profile of heating and cooling, such as UV irradiation → heating → cooling, can be freely combined and set by programming (room temperature to 180°C). *Optional up to 300°C. Reproduction of Boundaries Reproducing the shrinkage rate and shrinkage stress experienced by products subjected to various heats during the manufacturing process or placed in various environments over long periods. Measurement of Temperature Changes on Resin Surfaces A small sample volume (about 1cc) is sufficient. No special measurement techniques are required.
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Applications/Examples of results
●Measurement Example Relationship between shrinkage rate and stress during the curing process of thermosetting epoxy resin ●Explanation Comments from measurement data At the initial stage of heating, the resin expands due to thermal expansion. Next, the reaction begins, leading to shrinkage caused by the reaction (shrinkage due to cross-linking). At this time, the shrinkage stress also occurs slightly delayed from the shrinkage. It can be observed that the reaction shrinkage ends when it reaches a parallel state. After that, by lowering the temperature and returning to room temperature, thermal shrinkage occurs. It can also be seen that stress occurs in a similar manner. Thus, in the case of thermosetting resins, there are generally three stages: thermal expansion, reaction shrinkage, and thermal shrinkage. Since we cannot attach the measurement graph here, please contact us for more details or refer to our website.
Company information
Since starting my personal business in 1982, I have developed and manufactured various precision measuring instruments such as automatic viscometers, quantitative dispensing devices, fluorescent sensors, serum measurement devices, small tensile testing machines, and stretching machines. I have also established a rapid response system for high-difficulty special development requests from major chemical manufacturers and national university research institutions. While there are also requests for mass production and consumer-oriented manufacturing, I am dedicated to developing and producing products that can only be made by our company. Of course, I strive to adapt to various environmental changes and continuously pursue self-improvement in cutting-edge science and technology.
