IC wire bond / lead frame automatic inspection device LFX-1000

Our company will be exhibiting at the "MUSUBI Exhibition" held in Hyogo in October 2021 and in Sendai in April 2022. We plan to showcase the X-ray observation device "FX-400tRX/LL," which enables the acquisition of clear X-ray images with a high resolution of 2μm and a geometric magnification of 500 times. Additionally, we will also display the automatic inspection device for IC wire bonds and lead frames, "LFX-1000." At the exhibition, we will set up a free consultation corner for grants in partnership with TM Human Resources and Labor Consulting, where we will accept applications for manufacturing subsidies for small and medium-sized enterprises at no charge. We sincerely look forward to your visit. 【Features of FX-400tRX/LL】 ■ High-output X-ray source of 1110kV, 2004A allows for penetration of copper plates (3mm) and more ■ Image acquisition of fine details with a high resolution of 2μm ■ High magnification photography with a geometric magnification of 500 times ■ Separation of the front and back surfaces of the mounted circuit board using X-ray stereo method (approximately 4 seconds) ■ Acquisition of 300 layers of horizontal cross-sections of the mounted circuit board using X-ray stereo CT method (approximately 50 seconds) *For more details, please refer to related products and catalogs, or feel free to contact us.