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  6. Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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last updated:Jun 26, 2025

アイテス
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Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!

This is an example of analysis using EBSD for ceramics (Al2O3). In the "Observation/Elemental Analysis," it was determined to be Al2O3 based on elemental analysis using EDX, and it was observed that Si was scattered as shown in the map. In the "Analysis using EBSD," the distribution of crystal size and orientation can be confirmed using the EBSD method, and by highlighting the map, the features that appeared in the graph can be visualized. [Analysis Overview] ■ Observation/Elemental Analysis - Observation using SEM and elemental analysis using EDX ■ Analysis using EBSD - Observation of crystal structure using EBSD *For more details, please refer to the PDF document or feel free to contact us.

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2020-09-10_16h19_35.png

Example of analysis using EBSD (ceramics)

2020-09-10_16h19_35.png
2020-09-10_16h19_35.png 2020-09-10_16h19_39.png 2020-09-10_16h19_46.png 2020-09-10_16h19_50.png 2020-09-10_16h20_03.png
  • Related Link - http://www.ites.co.jp/analyze/index.html
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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] Screw

[Example of analysis using EBSD] Screw

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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EBSD analysis

EBSD analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

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Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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