Backside polishing of semiconductors for luminescence analysis.

Back grinding is possible with various types of semiconductors! You can observe the elements and the condition of defects.

Back Surface OBIRCH / As a preprocessing step for luminescence analysis and back surface luminescence analysis, we perform back surface polishing of samples with various shapes. This is an essential preprocessing step for conducting analysis from the back surface. By analyzing from the back surface, we can not only detect luminescence while retaining defects but also observe the presence or absence of shape abnormalities. Additionally, back surface polishing can be performed on various forms of semiconductors, including packages, opened chips, and wafers, and it is also possible to perform back surface polishing while maintaining the state of the lead terminals. 【Features】 ■ Back surface analysis requires polishing because it does not transmit light due to shading by electrodes or light attenuation by high-density substrates. ■ Luminescence can be detected while retaining defects. ■ The presence or absence of shape abnormalities can also be observed. ■ Back surface polishing while maintaining the state of the lead terminals is also possible. *For more details, please refer to the PDF document or feel free to contact us.

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