Cost reduction through compactification! It enables the shortest wiring compared to using through-hole patterns.
This product is a resin filling ink removal device that achieves a 30% improvement in mounting density for permanent hole filling. It allows for a reduction in the number of layers (e.g., from 6-layer boards to 4-layer boards) and can reduce costs through compacting. Additionally, it has noise suppression effects and eliminates the need for through holes between layers, which is highly beneficial for substrates with a high number of pins in BGA (Ball Grid Array) configurations. 【Features】 ■ Noise suppression effect ■ Reduction in the number of layers possible ■ Approximately 30% improvement in mounting density ■ Cost reduction through compacting ■ Enables the shortest wiring compared to using through hole patterns *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Points for Permanent Ink Removal】 ■ Proper Pressure Adjustment Program - Polishing that is not affected by the substrate's unevenness - Agility to respond flexibly to changes in thickness of each individual board ■ Stability of Polishing Power - Enables consistent and uniform polishing at all times ■ Appropriate Selection - Choices made to achieve stable polishing power *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.
