Fumed silica slurry for oxidation film engineering
The "ILD(TM) Series" is a CMP slurry for oxide films that uses fumed silica. It is an industry-standard slurry that achieves a high polishing rate and reduces scratches and impurities, which is difficult to achieve with conventional colloidal silica slurries, and can also be used for glass-epoxy polishing. [Overview] - Suitable for oxide film process polishing requiring low scratch performance - KOH/ammonia-based - Overwhelming reduction of metallic impurities - High mechanical polishing characteristics *For more details, please download the PDF or feel free to contact us.
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【Lineup】 ■ILD3013 - Main component: Fumed silica - Chemical: Ammonia - Abrasive concentration (wt%): 13.7 - pH: 10.5 - Abrasive size (nm): 85 ■ILD3225 - Main component: Fumed silica - Chemical: KOH - Abrasive concentration (wt%): 25.7 - pH: 11.0 - Abrasive size (nm): 85 *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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At Anchor Tech Co., Ltd., we offer a wide range of proposals that meet our customers' needs, including CMP/polishing pads with an extremely high track record both domestically and internationally, such as IC1000 and SUBA, as well as CMP/polishing slurries, work holding materials (templates/backing materials), conditioners, and more. Additionally, we provide sales and rentals of measurement equipment such as particle counters, TOC meters, pressure distribution measurement devices, and rapid microbial testing kits, so please feel free to contact us if you have any requests.