Investigation of the joint condition and joining methods of crimp terminals, as well as the types of materials! Introduction to cross-sectional observation and elemental analysis using SEM/EDX.
I would like to introduce the topic of "Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX." We conducted cross-section preparation of the joint area of the copper crimp terminal fixture for resistance measurement, applied chemical etching to the prepared cross-section, and observed the metal structure before and after etching. As a result, we infer that the detected elements are P (phosphorus), Ag (silver), and Cu (copper), indicating that it is a silver-containing phosphorus copper solder material. *For more details, please refer to the PDF document or feel free to contact us.*
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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