Production equipment compatible with 2 reaction chambers and 2 cassettes! Capable of deep Si etching from nano to micro levels.
The RIE-800BCT is a production silicon deep etching device that employs inductively coupled plasma in its discharge method. It enables high-aspect-ratio processing of over 50 and low scallop processing while maintaining a high etching rate and selectivity with resist. Additionally, by rapidly switching gases, it can reduce scallops while maintaining the etching rate. 【Features】 - Capable of deep silicon etching from nano to micro levels - Supports wafers up to 8 inches in diameter - High-aspect-ratio processing of over 50 - Low scallop processing - Extensive process library *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 - Equipped with a unique plasma generation source and reactor structure, enabling high aspect ratio processing while maintaining vertical etching shapes. - By performing rapid gas switching, it is possible to reduce scalloping while maintaining the etching rate. - Various shapes and materials can be processed thanks to the accumulated process library. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Application Examples】 ■ Fabrication of MEMS (accelerometers, gyroscopes, pressure sensors, actuators, etc.) ■ Processing of inkjet printer heads ■ Formation of silicon through-silicon vias (TSV) ■ Fabrication of power devices (super junction MOSFETs) ■ Plasma dicing *For more details, please refer to the PDF document or feel free to contact us.
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.
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