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  6. Load-lock type plasma ALD system "AD-230LP"

Load-lock type plasma ALD system "AD-230LP"

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last updated:Jan 18, 2021

サムコ
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Alternately supply organometallic materials and oxidants to the reaction chamber, and film formation occurs only through surface reactions.

The "AD-230LP" is an ALD device capable of atomic-level film thickness control. It supplies organic metal precursors and oxidizers alternately to the reaction chamber, forming a film solely through surface reactions. With a load-lock chamber, it does not expose the reaction chamber to the atmosphere, allowing for highly reproducible film formation. Additionally, by adopting a capacitively coupled plasma (CCP) method, it minimizes the volume of the reaction chamber, shortens gas purge times, and accelerates each cycle. 【Features】 - Conformal film formation at the top, middle, and bottom - Uniform layer control at the atomic monolayer level - Conformal film formation possible for high aspect ratio structures - Excellent in-plane uniformity and reproducibility, achieving a stable process - Unique reaction chamber structure suppresses particles *For more details, please refer to the PDF document or feel free to contact us.

    Other physicochemical equipment
2021-01-17_02h04_55.png

Load-lock type plasma ALD system "AD-230LP"

2021-01-17_02h04_55.png
2021-01-17_02h04_55.png
  • Related Link - https://www.samco.co.jp/products/cvd/ald/ald_ad-23…

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【Other Features】 - A gate insulating film with excellent characteristics is formed by a two-layer deposition using thermal ALD and cathode CVD. - By adopting a capacitively coupled plasma (CCP) method, the reaction chamber volume is minimized, reducing gas purge time and accelerating the cycle. - Equipped with a load lock chamber, allowing for deposition with excellent reproducibility without exposing the reaction chamber to the atmosphere. *For more details, please refer to the PDF document or feel free to contact us.

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【Application Examples】 ■ Film formation of nitride films (AlN, SiN) and low-temperature formation of oxide films (AlOx, SiO2) ■ Gate insulating films for electronic devices ■ Passivation films for semiconductors and organic EL, etc. ■ Reflective surfaces of semiconductor lasers ■ Film formation on three-dimensional structures such as MEMS, etc. *For more details, please refer to the PDF document or feel free to contact us.

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サムコ

サムコ

Industrial Machinery

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We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.

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