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  6. 8-inch wafer solder bump printer "MT-80SP"

8-inch wafer solder bump printer "MT-80SP"

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last updated:May 07, 2024

マイクロ・テック
マイクロ・テック
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Test printing is possible! Printing on polyimide coverings and more can be done with high precision and fully automatically.

The "MT-80SP" is a fully automatic screen printing machine for wafers, designed for cassette-to-cassette operation and compatible with various wafer sizes. The loader section is equipped with cassettes (compatible with various standards). A horizontal transport robot arm automatically retrieves the wafers, performs pre-alignment (notch detection), carries out the printing process, and then stores them back in the cassette. It can print solder bumps and polyimide coverings with high precision and fully automatically. An FFU installation is also available as an option. 【Features】 ■ Test printing available ■ Compatible with various wafer sizes ■ Loader section equipped with cassettes (compatible with various standards) ■ High precision and fully automatic printing ■ FFU installation available as an option * Test printing is available! Please feel free to contact us. * For more details, please refer to the PDF materials or feel free to contact us.

    Photomask
2021-03-22_10h18_07.png

8-inch wafer solder bump printer "MT-80SP"

2021-03-22_10h18_07.png
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  • Related Link - https://www.e-microtec.co.jp/products/mass-produce…
  • Special site - Product/service details - https://pr.mono.ipros.com/e-microtec/product/

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basic information

【Basic Specifications】 ■ Printing Dimensions: 8-inch wafer, 6-inch wafer ■ Frame Dimensions: 550 mm x 650 mm outer dimensions ■ Printing Machine Section Image Recognition (Binarization / Pattern Matching): Alignment Method Alignment Accuracy ±10μm ■ Screen Size: 550 mm × 650 mm ■ Squeegee Pressure Control: Vertical Float Type Air Balance System ■ Squeegee Drive: ULVD (Ultra Low Vibration Drive) System (PAT.P) *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Applications】 ■Electronic components ■Solar cells ■Touch panels ■Films ■Devices ■Automotive parts ■Fuel cells ■Semiconductors *For more details, please refer to the PDF document or feel free to contact us.

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8-inch wafer solder bump printer "MT-80SP"

8-inch wafer solder bump printer "MT-80SP"

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マイクロ・テック

マイクロ・テック

Industrial Machinery

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The scope of printing technology is increasingly expanding into fields such as solar cells, smartphones, and various electronic components, with a growing demand for "high-precision screen printing" technology. Thanks to your support, our company is celebrating its 35th anniversary and has developed into a company that is recognized by global enterprises creating new markets for the next generation. Among the few manufacturers of high-precision printing machines, our technology is trusted and valued by our customers. Today, our products have become indispensable to the advancement of cutting-edge printed electronics, spanning a wide range from electronic components to solar cells, fuel cells, FPCs, and smartphones. Moving forward, we will continue to prioritize customer satisfaction as we have in the past, dedicating ourselves to technology development that anticipates the needs of the times, and striving to deliver even higher precision products and services to meet our customers' expectations, while continuing to take on challenges both domestically and internationally.

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