Hot melt molding that achieves ecology with solvent-free resin.
Our company conducts "hot melt molding," which allows us to inject low-melting-point thermoplastic resin into molds under low pressure, adding diverse and excellent protective performance to various electronic components through insert molding. Compared to conventional methods, this reduces damage to delicate electronic components. Furthermore, it enables improvements in productivity, as well as weight reduction and miniaturization. Additionally, since the external shape can be directly molded, it also contributes to enhanced design quality. 【Technical Overview】 ■ Molding Temperature: 170–240°C ■ Molding Pressure: 1–30 MPS ■ Curing Time: Several seconds to a few minutes ■ Resin: Solvent-free ■ Design: No case required ■ Inserted Components: Minimal damage *For more details, please download the PDF or feel free to contact us.
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basic information
**Main Uses** ■ Electronic components used in water-related applications ⇒ Waterproof and moisture-proof ■ Electronic components used outdoors ⇒ Weather resistance ■ Parts operating in harsh environments such as chemicals and oils ⇒ Chemical resistance and oil resistance ■ UL94 V-0 grade available ⇒ Flame retardancy ■ Stress relief for operation and wiring extraction ⇒ Flexibility and vibration resistance *For more details, please download the PDF or feel free to contact us.*
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Company information
Our company handles precision parts for automobiles, precision contacts for small motors, micro switches for office automation equipment, and various precision components for office automation devices. We will continue to challenge the infinite possibilities as an electronic component manufacturer to meet the evolving needs of society.
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