High-quality crystalline silicon layer! Significantly promotes die miniaturization compared to conventional junction isolation methods using MEMS technology.
Ice Moss provides dielectric separation technology that separates high-voltage sections and components on a single chip. Isolation uses thick film SOI, deep trench etching with a high aspect ratio, and embedded structures of oxide film and poly. This technology is applicable to wafer sizes of 100-150mm, with device layer thicknesses ranging from 1.5 to 100um. 【Features】 ■ Elimination of embedded layers ■ High-quality crystalline silicon layer ■ Elimination of epitaxial layers ■ Minimization of parasitic capacitors ■ Elimination of P+ isolation *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Increased die yield per wafer achievable simultaneously ■ High breakdown voltage characteristics ■ Customized trench patterns ■ Complete device isolation ■ Significantly promotes die miniaturization compared to conventional junction isolation methods ■ Lower defect density compared to conventional DI technology ■ Lower substrate capacitance than bulk ■ Lower cost than trench isolation by EPI *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ MEMS devices ■ Solid-state relay photovoltaic generators ■ Solar cells and optoelectronic devices/ICs ■ High-voltage analog ICs for telecom ■ High-performance bipolar circuits ■ Smart power ICs ■ Integrated sensors *For more details, please refer to the PDF document or feel free to contact us.
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Our company was established in 2004 as a best-in-class supplier providing high-voltage power MOSFETs and MEMS technology processes that deliver high performance for power supplies, advanced technology base wafers, SOI (silicon on insulator), and bonded silicon substrates at a high cost-effectiveness. (Headquartered in the U.S., with manufacturing facilities in the U.K. and R&D in Tokyo) We have developed and realized high-voltage super junction MOSFETs with innovative deep trench etching MEMS structures through a simple and low-cost process. Please feel free to contact us if you have any inquiries.