Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not expose the wafer to high temperatures during the process, preventing thermal degradation. - It allows for control of film thickness and enables thin film formation (with a proven 33% cost reduction). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with a proven range of Au 70 to 90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling highly reliable bonding. - There are few voids and impurities, and no flux is needed, so cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.
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basic information
Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. The gold-tin alloy plating developed by Mitsuya allows for control of a uniform eutectic composition plating film. It enables high-reliability bonding at high temperatures. As noted in the points above, it generates many advantages.
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【Application】Semiconductors, Electrical and Electronics - Sensors 【Problems Solved】Good soldering and bonding properties, high conductivity, low contact resistance, cost reduction 【Achievements in Solutions】 Customer Issue: When fusing gold-tin foil to the wafer, the high temperatures during the fusing process caused thermal degradation of the wafer, leading to wafer loss costs. Despite inquiries to numerous plating manufacturers, there was no company capable of mass-producing gold-tin alloy plating, which was a significant problem. ⇒ Achieved mass production of gold-tin alloy plating! Reduced wafer loss costs by over 10 million yen per year! We also received numerous inquiries from overseas.
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Gold-tin alloy plating: Plating onto fine patterns
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Company information
Mitsuya is a company that specializes in metal surface treatment and plating, founded in 1931. We focus not only on general plating but also on plating for difficult materials, offering around 90 different types of plating. Currently, plating has become an essential part of advanced technologies such as IT, electronic devices, ubiquitous computing, next-generation energy, next-generation motorization, and environmental technology. In this context, Mitsuya Co., Ltd. responds to customer needs with a spirit of "let's give it a try" to meet strict requirements, earning a reputation for being the go-to company when faced with challenges. We have established partnerships with many companies, including those in the manufacturing of electronic and electrical devices, as well as automotive and transportation equipment. We will propose the most suitable plating technology based on your consultation needs. We also accommodate small-scale prototypes starting from just one piece, so please feel free to contact us with any inquiries, no matter how trivial.
![[Case Studies of Plating Solutions] Plating on Difficult Materials](https://image.mono.ipros.com/public/product/image/d06/2000696866/IPROS89025081192026733214.png?w=280&h=280)
