We achieve reliable and stable workpiece adhesion and fixation in various industrial machinery and equipment.
The "Porous Chuck" is a component primarily incorporated into dicing saws, bonders, and inspection equipment in the semiconductor manufacturing process. By utilizing the porous structure of the table surface and negative pressure, it is possible to hold thin silicon wafers flat. We manufacture it as a "one-of-a-kind" product, customizing the appropriate materials and shapes according to the specifications and requests of each customer. Additionally, we offer a variety of unit products with added functions, such as "HoVaC" and "Surface Emitting Porous Chuck." 【Features】 ■ Stable adhesion ■ Diverse porous materials ■ High precision and quality ■ Flatness of 3μm or less ■ MADE IN JAPAN *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Material】 ■Porous ・Alumina ceramic ・SiC (Silicon carbide) ・SUS (Stainless steel) ・Resin ■Body ・SUS (Stainless steel) ・Aluminum ・Ceramic *For more details, please refer to the PDF document or feel free to contact us.
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【Examples of Use】 ■ Semiconductor manufacturing equipment ■ Various semiconductor inspection and measurement equipment ■ FPD manufacturing equipment, transport equipment ■ Image analysis equipment, various drawing devices, optical microscopes ■ Lithium-ion batteries ■ Medical devices ■ Printing transport and coating, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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We will shape "what you want" through conversations with our customers. Even if you cannot create a drawing, our staff will create the drawings while listening to your ideas. Our company has a comprehensive system in place from design to manufacturing and delivery.
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