ICA1205 is a multi-laser dicing device that employs a multi-beam structure.
Achieved through a multi-laser structure: - Enables finer cutting - Reduces temperature during cutting - Minimizes impact on the substrate Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices 〇 Other ASM equipment handled: - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm to 25µm) 〇 ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year
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Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices
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Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.