Using a laser as a heat source: How does it affect bonding?
In laser bar bonding, achieving a void-free gold-tin eutectic joint is a very simple process. With conventional bonders, both the substrate and the die are heated in some way, allowing for a void-free joint to be realized without damaging the completed assembly. Void-free bonding means that no thermal shock is applied to the substrate or die during the joining process. This blog introduces "laser assist and laser bonding." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.