We process long materials, large plates, and a variety of small quantities.
At Hochang Precision Machinery, we not only perform grinding processing but also machining with cutting machines. We handle small quantities of various types, long materials, and large plate products. With special specifications, we can achieve high-speed processing (up to 60,000 RPM), enabling grinding processing with grinding wheels that was not possible with conventional machining. We provide optimal grinding processing for ceramics, where processing with grinding wheels is essential. 【Processing Range】 400H × 2300W × 2900L
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basic information
【Business Overview】 ○ Large-scale ultra-precision grinding ○ Large-scale MC grinding ○ Polishing processing *For more details, please contact us or download the catalog.
Price range
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Large plate products, wiping nozzles, machine parts, exposure devices, coating dies, T-dies, semiconductor parts, special shapes, etc.
Detailed information
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T-dice (sample)
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Material: A5052 Size: 1000×2000 Precision: Flatness and parallelism 0.05
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Material: A5052 Size: 800×2800 Accuracy: Flatness and parallelism 0.03
Line up（6）
| Model number | overview |
|---|---|
| UPG-6025 | Static Pressure Surface Grinding Machine |
| UPG-408 | Static Pressure Surface Grinding Machine |
| PSG-5026 | Surface Grinding Machine |
| PSG-208 | Surface Grinding Machine |
| PSG-106 | Surface Grinding Machine |
| SPH-3000 | Polishing Machine |
catalog（1）
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Company information
In April 1982, Kocho Seiki Co., Ltd. started as an engineering company dealing with the development and design of various machines. In 2005, aiming to further enhance our development capabilities, we built the Amagasaki factory under the goal of developing processing technology. We introduced hydrostatic grinding machines, polishing machines, and machining centers capable of handling large and long workpieces, responding to customer demands for ultra-precision machining. We primarily perform grinding, polishing, and cutting of ultra-precision parts used in large liquid crystal panel equipment, semiconductor manufacturing equipment, and coating equipment. We will continue to advance the development of processing technology based on quality control to the best of our ability. In the future, we will focus on the precision machining field and strive to further refine our technology. We will continue to approach our work with a positive attitude and respond to the increasing demands for higher precision in product processing. At the same time, we will explore new fields to better meet the diverse needs of our customers, aiming to be a company that grows and thrives every day. We sincerely ask for your continued support of Kocho Seiki Co., Ltd. Thank you very much.
![Ultra-precision grinding processing [Roundness 0.0005; Coaxiality 0.001]](https://image.mono.ipros.com/public/product/image/44d/2000318197/IPROS6864693667144364027.jpg?w=280&h=280)
![[Data] GSP Corporation Processing Case Collection](https://image.mono.ipros.com/public/product/image/bd9/2001126269/IPROS24507835801995000061.png?w=280&h=280)
