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  6. Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.

Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.

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last updated:Jan 11, 2023

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
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A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.

New method for non-contact suction of ultra-fine and long workpieces: Adoption of the vertical gas jet method (VGF method). The Bernoulli chuck "Float Chuck SA-CL series" has newly adopted the vertical gas jet method (VGFS) to efficiently suction ultra-fine and long workpieces. The vertical gas jet method reduces friction loss of the gas flow in the cushion chamber by vertically jetting the gas flow emitted from the nozzle, enhancing the effect of negative pressure generation, significantly increasing the suspension capability compared to conventional types, thereby improving the holding stability and resistance to impact, while nearly halving gas consumption.

    WaferWafer processing/polishing equipmentSeparation device
cyojaku3.jpg

Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.

cyojaku3.jpg
cyojaku3.jpg

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basic information

When the gap between the operating surface and the workpiece is large, the gas ejection nozzle, cushion chamber, and the gap between the operating surface and the workpiece function respectively as the ejector nozzle, vacuum chamber, and diffuser. As a result, a negative pressure is generated in the cushion chamber, pulling the workpiece closer. When the workpiece is drawn in and the gap between it and the operating surface decreases, the cushion chamber functions as a pressure chamber type air cushion (hovercraft), causing the pressure in the cushion chamber to rise sharply and separating the workpiece. The distance that automatically maintains the balanced pressure in the cushion chamber between the operating surface and the workpiece allows the workpiece to be suspended in a non-contact state, floating in the air.

Price range

P4

Delivery Time

Please contact us for details

Applications/Examples of results

1. Non-contact transport of ultra-thin, long wafers and chips 2. Non-contact transport of optical glass chips 3. Non-contact transport of optical resin materials 4. Medical surgical assistive materials

Company information

ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

Product/Service List (68)

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