It is a backing plate used in a film-forming device.
This is a backing plate manufactured from C1020 (oxygen-free copper) for use in semiconductor equipment deposition systems. The shape has been formed using a milling machine, with some parts processed on a machining center. Due to the pocket machining and the resulting thin remaining plate thickness, this product is prone to warping and distortion; however, we have processed it to ensure that both flatness and planarity are within 0.1mm. In general, when processing copper, it is particularly noted that corners and similar areas are prone to scratches and dents during deburring. Therefore, at Copper Plate Processing.com, we carry out chamfering on thin areas using a machining center to ensure a tight fit during assembly. As such, processing copper often comes with unique challenges that require individual solutions. If you wish to process copper, please contact Copper Plate Processing.com. We will propose appropriate processing and treatment solutions.
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basic information
【Features】 〇Overview: Backing plate for film deposition equipment 〇Material: C1020 〇Size: 111☓313☓10tt 〇Industry example: Film deposition equipment
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The example in the image is a case of backing plate production, which we also specialize in. There are many similar cases, so please contact us for more details.
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This is a backing plate manufactured from C1020 (oxygen-free copper) for use in semiconductor equipment deposition systems. The shape has been formed using a milling machine, and some features have been processed with a machining center. Due to the pocket machining and the resulting thin remaining plate thickness, this product is prone to warping and distortion; however, we have processed it to ensure that both flatness and planarity are within 0.1mm. In general, when machining copper, it is particularly noted that corners and similar areas are prone to scratches and burrs during deburring. Therefore, at Copper Plate Processing.com, we perform chamfering on thin areas using a machining center to ensure a tight fit during assembly. As such, machining copper often comes with unique challenges that require individual attention. If you are looking to process copper, please contact Copper Plate Processing.com. We will propose appropriate machining and treatment solutions.
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Company information
Aject Co., Ltd. is based in Hidaka City, Saitama Prefecture. We have a track record of manufacturing semiconductor equipment, vacuum equipment, medical device components, and quantum computer components, and we specialize in the precision processing of copper and aluminum parts. Since our establishment, we have accumulated many achievements through our unique technological capabilities and quality management, and we have obtained ISO 9001 certification. Additionally, based on our past experiences, we provide solutions tailored to our customers' applications and strive daily to be a supportive partner. The materials we handle are primarily copper, but we also work with aluminum, stainless steel, brass, and more, offering the technology we have cultivated through copper processing. In addition to various types of machining, we also provide processes such as stamping, welding, and plating, and any processing that we cannot handle in-house will be done by our partner companies. This allows us to manage everything consistently, so you don’t have to request each type of processing separately. In the past, we have manufactured various industry components, including backing plates, heat sinks, busbars, and vacuum chambers. If you have any concerns from design to processing, please feel free to contact us.