Terminals for power semiconductors (press & surface treatment)
By performing surface treatment in-house, we achieve the appropriate surface condition!
At FineNex, we manufacture and sell terminals for power semiconductors (press and surface treatment), accommodating production from 10,000 units to several hundred million units per month. We produce terminals used in power semiconductor-related module components through press processing such as punching and bending. We have established a unique technology for gold plating only on necessary parts by performing Au plating on a Ni base, enhancing our analytical capabilities and quality control, and contributing to the promotion of energy-saving products. 【Features】 - Produced through press processing such as punching and bending - Molds can be proposed in-house (some outsourced) - Terminals for power semiconductors are wire bonded with gold or aluminum - Achieving suitable surface conditions by performing surface treatment in-house - Established a unique technology for gold plating only on necessary parts by performing Au plating on a Ni base - Enhanced analytical capabilities and quality control, contributing to the promotion of energy-saving products *For more details, please refer to the related links or feel free to contact us.
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【Reference Specifications】 ■Reference Standard: Plate thickness t = 0.1mm and above ■Material: Brass, phosphor bronze, and other options available upon consultation ■Surface Treatment: Ni undercoat, soft gold (gold purity 99.99%) plating *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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Through years of accumulated expertise in the plastic processing technology of wire materials, we are capable of producing a wide range of products, from micro pins with a wire diameter of φ100μm or less to large forged parts for automobiles, all through header forging processing. With over 2,000 in-house processing machines, we have established a mass production system for some of the world's leading forged components. For PGA terminals used in CPUs for personal computers, where we have achieved a top global market share, we supply over 10 billion units monthly, contributing to the advancement of the IT society. Leveraging our know-how in forging processing, we respond to the needs of customers across various fields, including consumer goods, automotive, and medical applications. Additionally, we possess a consistent manufacturing line that extends from forging processing to plating, press processing, insert molding, and assembly of components, allowing us to provide parts with higher added value by combining various processing methods, not just limited to forging. We also cater to a wide range of needs, including OEM assembly of high-quality parts such as automotive sensor components and other vehicle parts that require stringent quality standards.
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