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Heat sink heat dissipation pins and heat dissipation terminals

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last updated:Mar 22, 2024

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
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Heat is easily transmitted and dissipated! Long terminals with high heat dissipation capability can also be produced.

This product is processed by forging metal wire into the desired shape, allowing for lower mold costs compared to extrusion molded products. The length of the heat dissipation pins and the layout on the heat dissipation plate are flexible. We can also manufacture long terminals with high heat dissipation properties. Depending on the needs of customers considering heat dissipation measures for circuit boards and IC components, we provide consistent support from material selection to prototyping and mass production. 【Features】 ■ Processed into the desired shape ■ Mold costs can be kept low ■ Flexible layout on the heat dissipation plate ■ Consistent support from material selection to prototyping and mass production *For more details, please refer to the PDF materials or feel free to contact us.

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Heat sink heat dissipation pins and heat dissipation terminals

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  • Related Link - https://www.finecs.co.jp/products/composite/1702.h…

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basic information

【Specifications】 ■Materials: Copper, Silver, Aluminum, etc. ■Wire diameter: φ0.3mm and above ■Plating specifications: Ag, Ni, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Applications】 ■ Various semiconductor components, integrated circuit parts, multilayer substrates, heat sinks, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink heat dissipation pins and heat dissipation terminals

Heat sink heat dissipation pins and heat dissipation terminals

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ファインネクス

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所

Electronic Components and Semiconductors

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Through years of accumulated expertise in the plastic processing technology of wire materials, we are capable of producing a wide range of products, from micro pins with a wire diameter of φ100μm or less to large forged parts for automobiles, all through header forging processing. With over 2,000 in-house processing machines, we have established a mass production system for some of the world's leading forged components. For PGA terminals used in CPUs for personal computers, where we have achieved a top global market share, we supply over 10 billion units monthly, contributing to the advancement of the IT society. Leveraging our know-how in forging processing, we respond to the needs of customers across various fields, including consumer goods, automotive, and medical applications. Additionally, we possess a consistent manufacturing line that extends from forging processing to plating, press processing, insert molding, and assembly of components, allowing us to provide parts with higher added value by combining various processing methods, not just limited to forging. We also cater to a wide range of needs, including OEM assembly of high-quality parts such as automotive sensor components and other vehicle parts that require stringent quality standards.

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