Wafer support member for semiconductor manufacturing process (CFRP wafer ring development product)
Developed a dicing frame (wafering) using CFRP 3D printing technology. It is lightweight and has high rigidity, making it excellent for wafer transportability.
- Manufactured using continuous carbon fiber 3D printing and press molding technology. - Smooth appearance with no catches. - Lightweight and particularly excellent in circumferential strength and rigidity. - Does not experience expansion or contraction due to temperature changes like stainless steel.
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basic information
In addition to general-purpose grades, we also offer grades that excel in low emissions, heat resistance, and chemical resistance depending on the usage environment. (1) Benzoxazine resin grade Heat resistance temperature (Tg): approximately 180°C (2) Cyanate resin grade Heat resistance temperature (Tg): approximately 250°C (3) High-performance polyamide resin grade Heat resistance temperature (Tg): approximately 80°C
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Applications/Examples of results
Test cuts of 6-inch silicon wafers have been verified. We accept requests for sizes and shapes as needed.
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Company information
Our company is a comprehensive manufacturer in the plastic-related field, covering the production and sale of thermosetting resin molding materials, the production and sale of special molded products made from thermoplastic plastics, the manufacturing and sale of molding molds, as well as the compounding and procurement of engineering plastics and their sale, and the procurement and sale of machinery and equipment related to plastic molding, such as injection molding machines. In addition to these, we also engage in the production of composite materials made from carbon fibers and synthetic resins. Please feel free to contact us if you have any inquiries.