The substrate can be soda glass, non-alkali glass, quartz, wafers, etc.! We can supply them or arrange them for you.
We offer "outline cutting and chamfering processing" at our company. We support scribing, dicing (outsourced), and wire chamfering. The substrates can be soda glass, non-alkali glass, quartz, wafers, etc., and can be supplied by you or arranged by us. The thickness ranges from 0.1mm to 10±0.05mm depending on the substrate conditions. 【Processing Details】 ■ Scribing ■ Dicing (outsourced) ■ Wire chamfering *For more details, please feel free to contact us.
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【Processing Size】 ■ Scribing (Dimensional Tolerance: ±0.2mm) ・MAX: 500mm×400mm ⇒ MIN: 10mm×10mm ■ Dicing (Dimensional Tolerance: ±3μm) ・MAX: 300mm×300mm ⇒ MIN: 0.3mm×0.3mm ※ Thickness… 0.1mm～10±0.05m (depending on substrate conditions) *For more details, please feel free to contact us.
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Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.
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