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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. UP Colloidal Silica Polishing Agent for Sample Grinding [Made in Japan]

UP Colloidal Silica Polishing Agent for Sample Grinding [Made in Japan]

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last updated:Mar 31, 2026

アイエムティー
アイエムティー
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Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!

We would like to introduce the "UP Colloidal Silica Abrasive" handled by IMT Corporation. This product uses silica classified as "not applicable" under the Industrial Safety and Health Act's managed chemical substances. The product is an abrasive that can be dispersed in various organic solvents such as alcohol. With a particle size of 0.045μm, it is resistant to aggregation and sedimentation, resulting in a transparent liquid. For more details, please feel free to contact us. 【Product Lineup (Volume)】 ■1L ■5L *For more information, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipmentOther abrasives
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UP Colloidal Silica Polishing Agent for Sample Grinding [Made in Japan]

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image_27.png
  • Related Link - https://e-imt.co.jp/index.html
  • Special site - Product/service details - https://pr.mono.ipros.com/e-imt/product/

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Sample grinding *For more details, please refer to the PDF document or feel free to contact us.

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"2025 Latest Edition" Sample Preparation Equipment & Consumables Comprehensive Catalog Ver.6

"2025 Latest Edition" Sample Preparation Equipment & Consumables Comprehensive Catalog Ver.6

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Sample grinding UP colloidal silica abrasive [Made in Japan]

Sample grinding UP colloidal silica abrasive [Made in Japan]

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アイエムティー

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Testing, Analysis and Measurement

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Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.

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The related categories of Wafer processing/polishing equipment

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  • Wafer processing/polishing equipment
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  • Abrasives
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