Not only the joints of electronic components, but also the evaluation of fixed parts such as screws!
At AITES Co., Ltd., we conduct "Thermal Shock Testing." By repeatedly exposing samples to high and low temperatures, not only does stress occur due to thermal effects, but also due to the expansion and contraction of various parts. Repeated stress also adds to the overall stress. This test is conducted not only for the joints of electronic components but also for evaluating fixed points such as screws. 【Main Specifications of the Thermal Shock Testing Equipment】 ■ Internal dimensions: W650×H460×D370mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W650×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ ■ Internal dimensions: W970×H460×D670mm, Temperature range: -65 to 0/+60 to 200℃ *For more details, please refer to the PDF document or feel free to contact us.
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【Examples of Thermal Shock Test Standards】 ■JESD 22-A104 TEMPERATURE CYCLING ■IEC 60749-25 Temperature cycle ■EIAJ ED-4701/100 method 105 Temperature cycle ■MIL STD-883 1010.8 TEMPERATURE CYCLING ■Other various test standards are specified *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
