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  6. Thermal Conductivity Analysis Software THERMO

Thermal Conductivity Analysis Software THERMO

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PHOTO-THERMO

last updated:Jun 26, 2026

フォトン
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Finite Element Method Thermal Conduction Analysis Software (Simulator)

2D Axisymmetric and 3D Heat Conduction Analysis Simulator using Finite Element Method ■□■Features■□■ ■ Since it is an integrated pre-post tool dedicated to the PHOTO series, data creation, analysis, and result processing can be performed as a series of operations. ■ It is integrated with other PHOTO series modules, allowing for easy coupled analysis, such as obtaining temperature distribution from heat generation calculated by electromagnetic field analysis. ■ It uses the ICCG method, making calculations fast and enabling analysis on a personal computer. ■ Since it employs the finite element method, the solutions are stable, making it user-friendly even for beginners. ■ Coupled calculations with stress analysis and fluid analysis are easy to perform.

    Magnetic field analysis/electromagnetic wave analysisContract AnalysisAnalysis Services
THERMO.png

Thermal Conductivity Analysis Software THERMO

THERMO.png
THERMO.png
  • Related Link - https://www.photon-cae.co.jp/
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basic information

■ Linear and nonlinear thermal conductivity can be used. ■ Anisotropic linear thermal conductivity can be used. ■ Linear/nonlinear analysis of specific heat can be performed. ■ A reference temperature can be set. ■ The sliding interface allows for the handling of mutually moving objects. ■ Conditions for constant temperature boundaries, adiabatic boundaries, and heat transfer boundaries can be set. ■ Nonlinear analysis with temperature-dependent thermal conductivity can be performed. ■ Temperature dependence of specific heat can be addressed. ■ Radiation heat dissipation can be handled. ■ Coupling with dynamic magnetic field analysis, electric field analysis, and electromagnetic wave analysis is possible. ■ For other functions and details, please download the catalog or contact us.

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Applications/Examples of results

■□■Applicable Fields■□■ ■Fields where heat generation due to electromagnetic fields is a concern. Induction heating, electric cooking appliances, etc.

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[Analysis Case] Thermal Conductivity Analysis of a Circular Cylinder (Comparison with Theoretical Solutions)

[Analysis Case] Thermal Conductivity Analysis of a Circular Cylinder (Comparison with Theoretical Solutions)

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Electromagnetic field/electromagnetic environment analysis software PHOTO series

Electromagnetic field/electromagnetic environment analysis software PHOTO series

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Electromagnetic Field Analysis Software PHOTO-Series Overview Explanation

Electromagnetic Field Analysis Software PHOTO-Series Overview Explanation

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software

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At Photon, we are developing "electromagnetic field analysis software" that models and simulates products and components utilizing electromagnetic phenomena on a computer. In traditional design and development environments, the process has primarily revolved around trial and error through prototyping based on the experience of engineers and experiments with prototypes. However, conducting experiments using actual prototypes and analyzing the results requires significant time and cost. Moving forward, transitioning from an experimental and prototyping-based approach to an analysis-based design approach will be a crucial challenge for improving productivity, and establishing simulation technology as the core of analysis-based design techniques will be essential. In this context, Photon is developing and providing "analysis software" focusing on electromagnetic fields, as well as heat, vibration, and sound fields. By utilizing Photon's software, efficient development and design of various industrial products can be achieved. In this way, Photon aims to support users in reducing the number of prototypes, lowering development costs, and shortening development periods in their manufacturing environments, ultimately enhancing their competitiveness.

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