High-precision contour processing is possible with recognition of the substrate shape and added alignment correction!
High-precision processing with alignment correction is possible by recognizing the shape of the substrate. 【Features】 - Position measurement is performed for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision counterboring is possible.
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basic information
It is possible to perform high-precision processing with alignment correction by recognizing the shape of the substrate. 【Features】 - Position measurement is conducted for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision countersinking is achievable.
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It is possible to perform high-precision processing with alignment correction by recognizing the shape of the substrate. 【Features】 - Position measurements are conducted for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision counterboring processing is possible.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.