Not only the surface of the substrate! It is possible to perform recessed machining based on the inner layer surface of the substrate!
Detect the target inner layer surface with the router bit and perform the counterboring process based on that position. It can also be used for high-precision exposure of the inner layer copper foil or for processing that leaves a specified amount of inner layer resin.
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Detect the target inner layer surface with a router bit and perform the counterbore processing based on that position. It can also be used for high-precision exposure of the inner layer copper foil or for processing that leaves a specified amount of inner layer resin.
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Applications/Examples of results
Detect the target inner layer surface with a router bit and perform the counterboring process based on that position. It can also be used for high-precision exposure of the inner layer copper foil or for processing that leaves a specified amount of inner layer resin.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.