Technological capabilities that contribute to the development and practical application of advanced materials.
We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major types of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping equipment (DES), and cleaning devices that respond to the trends of high density and miniaturization. We take full responsibility for the design, manufacturing, assembly, construction, and maintenance of various devices.
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basic information
We will propose the optimal equipment configuration according to customer needs and processes, such as the material and thickness of the substrate, effective treatment width, treatment thickness, and transport speed, covering the entire wet process from subtractive methods (etching) to additive methods (plating), including SAP and MSAP. In recent years, with the advancement of high-performance materials, the trends of the materials we handle have changed with the times. Along with the evolution of these trends, we have handled a variety of materials, not only FPC but also indium tin oxide (ITO), glass, SUS, and iron, which support the demand for touch panels. Such technologies are expected to be utilized in the development of future advanced technologies, including components used in smartphones and computers, as well as future EV batteries.
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Detailed information
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Since starting in-house production of printed circuit boards in 1953, we have proposed surface treatment equipment that condenses our unique manufacturing technology cultivated over more than half a century. We take full responsibility for everything from design to manufacturing, assembly, construction, and maintenance of various equipment using the following technologies: - Plastic processing technology: cutting, welding, piping - Electrical control: gears, motors, blowers, winding/unwinding - Conveying technology: roll-to-roll, sheet-fed, horizontal, vertical, hoop
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Toa Electronics Group is pursuing technology and innovation based on its EMS business and wet process business. In the EMS business, we have established a consistent system from planning and development to assembly and manufacturing, providing electronic device-related services with high noise resistance, reliability, and durability. By handling video and content production as well as sound development in-house, we enhance the added value of our products and create unique appeal. In the wet process equipment business, we offer surface treatment equipment and wet process equipment compatible with thin film substrates. Utilizing our unique transport technology to suppress wrinkles, folds, and waviness in substrates, we flexibly accommodate various transport methods (horizontal, vertical, and hoop). We have a proven track record of supporting a wide range of substrates, including flexible substrates, rigid substrates, package substrates, and wafers. We pursue the reliability of electronic devices and innovation in surface treatment technology to support the next generation of manufacturing -- that is Toa Electronics!