Solder balls can be rapidly mounted in bulk on BGA substrates, connectors, and more. There is also a track record of mounting solder balls on items other than substrates.
This machine is a system that performs high-precision positioning using image processing to mount solder balls on PLP/BGA/CSP substrates. It supports not only bulk mounting by frame units but also simultaneous mounting of multiple individual substrates through optional features. It is also possible to propose a consistent line that includes the connection of inspection machines and peripheral devices such as mounters, reflow ovens, and cleaning machines. There is also a high demand for solder ball mounting on substrates with irregular shapes, such as connectors, and we provide system proposals from development to mass production.
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basic information
Main Features ■ Compatible with micro balls (φ0.15mm and above) ■ Bulk processing of substrates Flux transfer and ball mounting are possible for areas up to a maximum of 90×290mm. ■ Stable ball mounting Stable ball mounting is possible on warped substrates due to our unique pin transfer method for flux transfer. It is also compatible with stepped lands. ■ Supports multiple individual substrates mounting (optional) ■ We can provide a full line system including inspection systems and reflow ovens.
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Applications/Examples of results
For mounting solder balls for BGA/CSP.
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Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.