Successfully achieved a balance between the uniformity of the plating film thickness and good via filling properties! It also accommodates plating for core layers that require through-hole filling.
Triggered by the outbreak of the novel coronavirus infection, digital transformation (DX) has progressed, leading to rapid growth in markets such as internet shopping, electronic payments, and video streaming services. Additionally, electronic devices, including smartphones, continue to evolve significantly, and as the performance and miniaturization of these devices improve, there is a strong demand for higher density and thinner printed circuit boards. Semiconductor package substrates are formed using a semi-additive method, with interlayer connections made through via filling plating. As the miniaturization of circuits advances, it has become increasingly difficult to achieve both uniformity in plating thickness and good via filling properties. To achieve further uniformity in pattern plating thickness and excellent via filling properties, our company has developed a new additive for electroplating copper (copper sulfate), called Topluchina GAP.
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basic information
Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed circuit boards, as well as for general wet processes. Additionally, we provide the latest products and processes for the manufacturing of IC substrates and interposers produced through semi-additive processes, so please feel free to contact us.
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Semiconductor package substrate IC substrate
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.