Final surface treatment to form a void-free, uniform plating film on the circuit surface.
Final surface treatment process on copper circuits using a reduced cobalt catalyst solution! Contributes to improving the reliability of semiconductor packages and printed circuit boards.
Electronic components are mounted on printed circuit boards through wire bonding using gold, copper, or aluminum wires, and solder joints. Servers used for ultra-high-speed communication need to handle large currents and high capacities, requiring further performance enhancements and advanced connection reliability for the semiconductor packages and printed circuit boards used in them. Okuno Pharmaceutical Industry has successfully developed a catalyst solution using cobalt instead of palladium, establishing a final surface treatment process that forms a void-free and uniform plating film on the circuit surface. The ICP-COA process contributes to the reliability improvement of semiconductor packages and printed circuit boards.
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basic information
The ICP-COA process is the final surface treatment on copper circuits using the reduced cobalt catalyst solution ICP Accel COA. In conventional processes, a replacement-type palladium catalyst solution is used, which raises concerns about excessive dissolution of the copper circuit due to the substitution reaction, potentially leading to voids at the interface between the plating film and the copper circuit. By using ICP Accel COA as the catalyst solution, it becomes possible to form a void-free and uniform plating film on the copper circuit, thereby improving the reliability of wire bonding and solder joints. This process can be widely adopted for electroless nickel/gold plating and electroless palladium/gold plating processes for semiconductor packages and printed circuit boards. Okuno Pharmaceutical Industry responds quickly to surface treatment for all materials, so please feel free to consult with us.
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Applications/Examples of results
Final surface treatment for semiconductor package substrates and IC substrates.
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.
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