This is a device that supports the automatic transport of large substrates and can be applied from research and development to mass production. We will design it to meet your company's requirements.
This is a load-lock type sputtering device designed for the automatic transport of large substrates. 【Main Features】 - Capable of bare transport of large-diameter substrates, such as Φ300mm (support for square substrates is also possible). - Ensures a wide range of film thickness distribution with a uniquely designed cathode mechanism using standard target sizes. - Chamber structure that allows for easy target replacement and inspection/repair of the deposition chamber. - Future expansion of the process chamber is also possible. - Optionally equipped with a unique dense film formation unit (patented technology). We can also provide a video introduction of the device. Please feel free to contact us.
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basic information
Our sputtering equipment, boasting a wealth of experience centered around semiconductors and electronic components, has been newly released as a device compatible with large substrates. We will propose equipment specifications tailored to your needs with a variety of options.
Price information
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Applications/Examples of results
- Si semiconductor - Compound semiconductor - Semiconductor packaging process - High-density interconnection substrate - MEMS device
Detailed information
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Large substrate compatible load-lock sputtering system - Supports both bare transport and tray transport - Wide film thickness distribution with general-purpose targets - Chamber design considering easy maintenance - Equipment configuration compatible with future production increases
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.