We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 ■ Tray transport is also supported ■ Combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc. are also supported ■ Various custom-made options are available ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■Semiconductors ■MEMS ■Electronic components ■Optical components ■Automotive components *For more details, please refer to the PDF document or feel free to contact us.
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Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.
