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  6. Are you having trouble with the delivery time of semiconductor ICs?

Are you having trouble with the delivery time of semiconductor ICs?

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last updated:Jun 24, 2025

ケイ・オール
ケイ・オール
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From the smallest batch of one part to large-scale re-implementation! Please leave it to us!

Due to the current social situation, many people may be struggling with "the delivery times for semiconductor ICs." At K-All, we offer a 'Component Reconditioning Service' that may help break this situation. We accept requests without limiting the quantity. From small lot reconditioning of a minimum of one piece to large lot reinstallation, please leave it to us. You can view the detailed information through the related link, so please take a look. 【Component Reconditioning Service Details】 ■ Removal of specific components from your existing circuit boards ■ Solder removal work on the removed components ■ Reinstallation onto a different circuit board *For more details, please refer to the PDF document or feel free to contact us.

    Other semiconductors
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Are you having trouble with the delivery time of semiconductor ICs?

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  • Related Link - https://www.kei-all.co.jp/company/blog/post-3472/
  • Special site - Product/service details - https://pr.mono.ipros.com/kei-all/product/

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Technical Document "Underfill BGA Rework Technology"

Technical Document "Underfill BGA Rework Technology"

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Company Profile

Company Profile

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Excerpt of Prototype Parts Implementation Know-How

Excerpt of Prototype Parts Implementation Know-How

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Company information

ケイ・オール

ケイ・オール

Manufacturing and processing contract

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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.

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