HAXPES: Hard X-ray Photoelectron Spectroscopy
In HAXPES, it is possible to obtain information from deep positions (up to about 50 nm) from the sample surface. Furthermore, by using a two-dimensional detector for angle-resolved measurements, data obtained at a wide range of photoelectron emission angles can be divided into information corresponding to different angles, that is, varying detection depths. This allows for a comparison of depth-resolved bonding states to greater depths than XPS in a non-destructive manner. It is effective for evaluating materials where state changes extend not only to the surface but also into the bulk.
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Analysis of secondary batteries, electronic components, and manufacturing equipment and parts.
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!