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  4. Semiconductor Manufacturing Equipment
  5. Semiconductor inspection/test equipment
  6. CI Series Bare Chip Appearance Inspection Device for Power Modules

CI Series Bare Chip Appearance Inspection Device for Power Modules

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last updated:Jul 31, 2024

日精 本社
日精 本社
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By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module assembly!

The "CI Series" is a device that conducts visual quality inspections of individual bare chips stored in a chip tray, classifying them as good or defective. Detection examples include edge cracks, chipping, scratches, foreign matter adhesion, discoloration, etc. Using the standard multi-angle lighting, it is possible to set lighting conditions that capture various defect modes that appear on the product. This device is suitable for pre-shipment inspections by semiconductor bare chip manufacturers and contract manufacturers. Examples of target products include power devices, ICs, image sensors, and wafer chips for various sensors. <CI8000> - Six-sided inspection model (inspection of all six sides: front, back, and sides) - Fastest processing capability of 8000 CPH - Equipped with a stage that enables high-resolution inspections <CI200i> - Front and back inspection model - Space-saving by conducting surface inspection in the tray - Minimizes contact with the product, ensuring no damage - Equipped with a high-resolution inspection stage *For more details, please refer to the PDF document or feel free to contact us.

    Semiconductor inspection/test equipment
外観検査装置画像.png

CI Series Bare Chip Appearance Inspection Device for Power Modules

外観検査装置画像.png
外観検査装置画像.png
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<Features> ■ Adjustable to various defects with multi-angle lighting ■ Compact and space-saving design with all operations from the front ■ Minimizes contact with bare chips during in-tray inspection ■ Over-detection reduction tool through high-dimensional statistical analysis of image information (optional) <Model Lineup> ■ CI200i: Surface + backside inspection model ■ CI100i: Surface inspection model

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CI Series Bare Chip Appearance Inspection Device for Power Modules

CI Series Bare Chip Appearance Inspection Device for Power Modules

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日精

日精 本社

Machine elements and parts

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We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.

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