We will solve your concerns such as "It is difficult to secure personnel" and "Soldering quality is unstable"!
We would like to introduce our tabletop selective soldering series 'SPROBO & TAKUROBO' that we handle. We offer the spray fluxer "ULTIMA-SSP 'SPROBO'", the soldering device "ULTIMA-TRZ 'TAKUROBO'", and the preheater unit "PHS-430A". The benefits of implementation include cost reduction of materials and improvement and stabilization of quality. 【Features】 ■ Space-saving and energy-efficient ■ Production of a wide variety of small lots ■ Lightweight and layout-free ■ Compatible with M-size PCBs ■ Cell production compatible ■ Easy operation and program creation *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 < Spray Fluxer "ULTIMA-SSP 'SPROBO'" > ■ High application efficiency & optimal application amount setting < Soldering Device "ULTIMA-TRZ 'TAKUROBO'" > ■ Dross reduction & low running costs < Preheater Unit "PHS-430A" > ■ Far infrared panel heater * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."