The substrate size is X50×Y50mm (MIN), X330×Y250mm (MAX)! Introducing our soldering series.
We would like to introduce our tabletop selective soldering series, 'ULTIMA-TRZII/SPZII'. The board thickness ranges from 0.8 to 2.0 mm, and the nozzle is a two-fluid nozzle with an inner diameter of φ2 to 20 mm (standard specification) / air jet (optional). Please feel free to contact us when you need assistance. 【Specifications of ULTIMA-TRZII (excerpt)】 ■ Equipment dimensions: W620×D940×H442(mm) [for reference] ■ Power supply: Single-phase AC200V±5% 4kVA ■ Equipment weight: Approximately 120kg [for reference] ■ Notes: Nitrogen supply rate (reference value) 25L/min (0.4 to 0.5MPa) *For more details, please download the PDF or feel free to contact us.
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【Specifications of ULTIMA-SPZII (Excerpt)】 ■Device dimensions: W630×D910×H390(mm) [Reference] ■Power supply: Single-phase AC100–220V±10% 0.2kVA ■Device weight: Approximately 60kg [Reference] ■Remarks: Air supply 0.4–0.5MPa *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."