Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!
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