We offer a wide variety of high-performance FR-4 BT resins and materials such as Rogers!
We propose various substrate materials and suitable substrate manufacturing and assembly methods according to the substrate specifications and production quantities. We have experience with high multilayer, IVH, and BVH, so we can accommodate various specifications for internal vias upon consultation. If you have any questions about other materials or manufacturing specifications, please feel free to contact us. 【Handling Materials (Partial)】 ■ FR-4 CEM3 High Thermal Conductivity CEM3 ■ R-5775 (MEGTRON6) ■ FR-5 Equivalent (High Heat Resistance / High Elasticity / Low Thermal Expansion) ■ Hybrid Configuration ■ Ultra-thin / Flexible Multilayer *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Manufacturing Specification Area (Reference)】 ■Board thickness: Approximately 0.3mm to 5.0mm ■Copper foil thickness: Up to MAX 200μ ■L/S ・Outer layer 100μ/100μ ・Inner layer 70μ/70μ ■etc... *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We are a company that sincerely aims to bring hope and revitalization back to the printed circuit board industry through the "inherited technologies" of the Reiwa era and "innovative ideas" for the younger generation. As long as it relates to "printed circuit boards (hardware)," we will support our customers with sincerity and enthusiasm, no matter the phase or challenge, until the very end. ★ We are not a fabless production or outsourcing company, so please leave the optimization for cost reduction and the proposal for the shortest delivery times, from various designs to various productions, to us. We are happy to accept requests for design, rework, reballing, component mounting, and more. Please feel free to contact us with any requests you may have.
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