ラグレス Product Lineup

Our company provides component procurement (electronic parts purchasing agency service). By procuring with only the minimum necessary surplus in mind, we cut unnecessary costs, shorten lead times, and act as an agent for the fastest level of component aggregation. We secure products that are difficult for customers to obtain through our unique channels. 【Features】 <Significance> ■ Cost reduction ■ Quantity management <Immediate effect> ■ Unique procurement routes ■ Shortened lead times *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

At our company, we promptly verify the parts we receive, and if there are any shortages, we provide quick feedback, allowing for a smooth transition to the implementation process with ample time. If requested, we can also check the remaining parts after implementation, ensuring that there are no unnecessary costs for repeat implementations. The component mounting process is the most critical factor affecting product quality, and we set our standards based on the premise that only high quality can meet short delivery times. 【Features】 ■ Prevent schedule delays caused by missing parts ■ Challenges in various high-difficulty implementations cultivated from our curiosity ■ Optimization of efficiency and costs through circuit board design that unravels component mounting *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other contract services

We would like to introduce our "Circuit Board Design" services. We handle everything from single-sided TH boards to high-layer boards, including high-difficulty designs such as IVH and BVH boards. We also have a proven track record in meeting requests for high voltage, high current, and special boards. (*Impedance control can be proposed down to the board layer configuration.) If you have any concerns regarding circuit board design, please feel free to contact us. 【Features】 <High-frequency/High-speed transmission RF communication technology in the G band> ■ Suppression of waveform distortion ■ Calculation of delay using equal-length and equal-delay wiring ■ Circuit board design for handling microvolt-level signals *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Embedded system design service

We propose various substrate materials and suitable substrate manufacturing and assembly methods according to the substrate specifications and production quantities. We have experience with high multilayer, IVH, and BVH, so we can accommodate various specifications for internal vias upon consultation. If you have any questions about other materials or manufacturing specifications, please feel free to contact us. 【Handling Materials (Partial)】 ■ FR-4 CEM3 High Thermal Conductivity CEM3 ■ R-5775 (MEGTRON6) ■ FR-5 Equivalent (High Heat Resistance / High Elasticity / Low Thermal Expansion) ■ Hybrid Configuration ■ Ultra-thin / Flexible Multilayer *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We analyze the requirements sought by our customers, understand the specifications, and conduct discussions to provide various proposals for delivering a system with higher added value. We carefully create plans from the discussions and proposals to development and evaluation, aiming to improve the efficiency of subsequent work and suggesting reductions in development costs and timelines. We optimize the hardware development envisioned by our customers into custom boards that highlight functionality. 【Features】 ■ Analog and digital circuit design ■ Analog (high-speed signals, weak signals, etc.) ■ Flexible RTL design utilizing FPGA/CPLD/DSP *For more details, please refer to the PDF materials or feel free to contact us.

• Development support tools (ICE, emulators, debuggers, etc.)
• Other contract services

We will restore your requests based on our accumulated achievements and know-how to ensure that there is no impact on electrical characteristics. We provide X-ray images for checking the PAD directly under the package, allowing you to personally verify the solder joint condition. Additionally, due to our in-house processes, we deliver products in the shortest time possible. We can complete the pickup, parts replacement, and handover all within the same day at the shortest. 【Features】 ■ We deliver products faster than anyone else ■ X-ray images are provided for checking the PAD directly under the package ■ You can personally verify the solder joint condition ■ We restore to good quality with our extensive experience and achievements *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other contract services

Our company handles everything from single-sided boards to high-layer count boards and build-up boards, including high-difficulty board designs, and we also support transmission path and noise simulation verification. We propose optimal designs based on trust and proven results. Please feel free to consult us when you need assistance. 【Analysis (Partial)】 <SI Analysis> ■ Items: Reflection (crosstalk) / Timing / Transmission characteristics (S-parameters), etc. ■ Tools: Hyper LynxSI, SIwave <PI Analysis> ■ Items: Voltage drop (DC IR Drop) ■ Countermeasure examples: - Board wiring between the IC serving as the power supply and the IC receiving the power - Identifying layout modification areas such as adjusting power wiring width *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Analysis Services