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  6. Neutral flash etching solution "OPC Seed Etchant NE"

Neutral flash etching solution "OPC Seed Etchant NE"

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last updated:Mar 01, 2023

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Flash etching solution for copper sputter film compatible with fine circuit boards 'OPC Seed Etchant NE'

With the miniaturization, high performance, and high functionality of information and communication devices, semiconductor devices are now required to operate at high speeds. For the implementation of wiring on semiconductor package substrates and printed circuit boards, the method of forming a copper seed layer through sputtering followed by electroplating has become common to achieve further miniaturization and improved interlayer adhesion. Our company has newly developed a flash etching solution that preferentially etches copper sputtered films to accommodate copper sputtered films. There is a demand for technology that reduces transmission loss in copper films to support high-speed communication. To meet this demand, we have newly developed a flash etching solution for copper sputtered films that is optimal for fine circuit substrates and excels in planar smoothness.

    Chemicals
20230301-5.PNG

Neutral flash etching solution "OPC Seed Etchant NE"

20230301-5.PNG
20230301-5.PNG

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Rewiring layer formation technology for fine circuit boards, copper sputter film flash etching solution "OPC Seed Etchant NE"

Rewiring layer formation technology for fine circuit boards, copper sputter film flash etching solution "OPC Seed Etchant NE"

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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