Ceria Slurry

Excellent dispersion stability! Possesses high polishing rate and control capabilities for defects, dishing, and more.

The "Ceria Slurry" used in semiconductor CMP processes is a suspension made by mixing particles of 80 to 300 nm with ultra-pure water and chemicals. It serves the role of polishing the film quality of the target material both scientifically and mechanically. Additionally, the "Additive" used together with the Ceria Slurry during polishing enables selective polishing required in semiconductor processes, depending on the film quality. 【Features】 ■ Excellent stability of the slurry at low and high temperatures ■ Minimal particle agglomeration ■ Superior usability when mixed with additives ■ High polishing rate ■ Excellent control capabilities for defects, scratches, and dishing *For more details, please refer to the PDF document or feel free to contact us.

Composite Materials