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  5. Circuit board design and manufacturing
  6. Multi-chip packaging service

Multi-chip packaging service

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last updated:Jun 14, 2023

佐用精機製作所
佐用精機製作所
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We'll get started right after your consultation! We will implement the circuit board quickly with high positional accuracy!

Our service achieves high positional accuracy and speedy PCB assembly using the Daibonder DM60M-H. Even difficult-to-handle chips are optimally managed by our experienced staff. 【Features】 ■ Achieves high positional accuracy with chips ranging from one to six varieties. This service is advantageous when it is necessary to align optical centers. ■ High productivity is realized due to single transport. Simultaneous assembly of up to six varieties with one PCB recognition. ■ Investment can be minimized during small-scale production. We have a manufacturing line that specializes in small-scale production. You can use only the necessary amount of materials we have in-house. ■ We provide design know-how to achieve the above. For example, know-how for designing production jigs and bonding conditions for equipment, etc. We also accept inquiries related to optical characteristics.

    LED ModuleOther optical partsCircuit board design and manufacturing
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Multi-chip packaging service

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  • Related Link - http://www.sayo.co.jp/

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basic information

■ This is a multi-chip mounting service using Panasonic's DM60. ■ Regarding wafers Φ190, Φ150, Φ134 expand rings 5-inch, 6-inch, and 8-inch flat rings 5-inch grip rings can be used.

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Applications/Examples of results

We are using various sensors and light-emitting device-related implementations. 1) Light-emitting devices (lighting, irradiation devices) Multiple wavelength arrays Pseudo sunlight (light source for solar cell evaluation) UV irradiation device light source UV resin curing light source array 2) Optical sensors Infrared sensors (photo interrupters, photo reflectors) 3) MEMS sensors Infrared thermal

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佐用精機製作所

佐用精機製作所

Electronic Components and Semiconductors

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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

Product/Service List (46)

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