【UHS_X-ray CT System Imaging Case】FET Observation Case
XVA-160RZ Microfocus X-ray CT System
This is a case where a FET was imaged using a micro-focus X-ray CT system XVA-160RZ, and voids were detected.
This is an example of capturing an FET (Field Effect Transistor) using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder in the mounting area overlaps with the solder under the chip. By using CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.
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basic information
The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only facilitates efficient analysis operations but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.
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The XVA series has been our best-selling model since its launch in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. *1 User-centric function A feature that automatically follows the point of interest during fluoroscopic observation when actions such as detector tilt, stage rotation, and magnification changes are performed. This is our patented technology.
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Company information
Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. In addition to inspecting printed circuit board soldering implementations, we support research, development, and manufacturing across a wide range of fields, including semiconductor products, various electronic devices, automotive components and related industries, materials and composites, and medical-related areas.
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